In the cutting - edge field of semiconductor manufacturing, any slight change in the production environment can have a decisive impact on product quality. As a professional manufacturer with years of in - depth experience in the purification equipment industry, Guangzhou Cleanroom Construction Co., Ltd. deeply understands the core position of airflow pressure difference control in semiconductor cleanrooms. Today, we will comprehensively analyze the airflow pressure difference control solutions for semiconductor cleanrooms, helping you create a stable and efficient production environment.
Airflow Pressure Difference Control: The Key Defense Line in Semiconductor Production
Resisting Pollutant Invasion
The manufacturing process of semiconductor chips is extremely delicate. Once pollutants such as dust particles and microorganisms are mixed in, they may cause serious problems such as short - circuits and open - circuits in chips. Take the lithography process of advanced - process chips as an example. The line width on the chips has reached the nanometer level. A dust particle with a diameter of only 0.1 micrometers is enough to cause deviations in the lithography pattern, resulting in chip scrapping. By reasonably constructing the airflow pressure difference and keeping the cleanroom in a positive - pressure state, external pollutants can be effectively blocked, building an invisible protective barrier for chip production.
Ensuring Stable Process Operation
Semiconductor manufacturing encompasses a variety of complex processes such as lithography, etching, and doping. Each process has different requirements for environmental temperature, humidity, and cleanliness. A stable airflow pressure difference can ensure that the environmental parameters of each area are always maintained within the range required by the process, providing a solid guarantee for the smooth progress of the process. In the etching process, if the airflow is unstable, the distribution of the etching gas will be uneven, leading to inconsistent etching rates and seriously affecting the etching accuracy and product quality of the chips.
Precise Airflow Pressure Difference Control Solutions to Create a Pure Production Space
Scientific Area Division and Precise Pressure Difference Setting
· Core Production Area: Key processes such as lithography, etching, and doping are carried out in this area. Here, the requirements for cleanliness and positive pressure are extremely high. It is recommended that the pressure in the core production area is 15 - 25 Pa higher than that in the adjacent auxiliary areas, thus minimizing the risk of external pollutant invasion and ensuring that the chip manufacturing process is not disturbed by pollution.
· Auxiliary Production Area: Auxiliary areas such as the material temporary storage area and equipment maintenance area, although the cleanliness requirements are slightly lower than those of the core production area, still need to maintain a certain positive pressure. Generally, it is 5 - 10 Pa higher than areas such as ordinary corridors to prevent pollutants in the corridors from entering the auxiliary area and endangering the environment of the core production area.
· Personnel and Material Passages: For the passages where personnel and materials enter and exit the workshop, a reasonable pressure difference gradient needs to be carefully set to form an effective air - lock effect. When entering the clean area from the non - clean area, the pressure gradually increases with each door passed, acting like layers of checkpoints, effectively blocking pollutants from entering the cleanroom along with personnel and materials.
Selecting Advanced Equipment to Achieve Precise Control
· High - Precision Pressure Sensors: The high - precision pressure sensors independently developed by Guangzhou Cleanroom Construction Co., Ltd. have excellent performance. Their measurement accuracy can reach ±0.1 Pa, which can accurately capture the pressure changes in each area of the workshop in real - time, ensuring that abnormal pressure fluctuations are detected immediately and providing a strong basis for taking timely countermeasures.
· Intelligent Ventilation Control System: This system is closely linked to high - precision pressure sensors. According to the preset pressure difference values, it can automatically and precisely adjust the fan speed and valve opening, achieving intelligent and refined control of the airflow. Once it detects that the pressure in a certain area is lower than the set value, the system will quickly react, automatically increasing the air supply volume or reducing the air exhaust volume to quickly restore the pressure to the normal level.
Comprehensive Maintenance and Management to Continuously Protect the Stability of the Pressure Difference
Regular Calibration and Maintenance to Ensure Equipment Performance
Calibrate the pressure sensors strictly every six months to ensure the accuracy and reliability of the measurement data. At the same time, conduct a comprehensive inspection of the ventilation equipment regularly, carefully check whether the fan impellers are worn, whether the valves can open and close normally, etc., and replace the aging or damaged components in a timely manner to ensure that the equipment is always in the best operating condition.
Conducting Professional Training to Improve Personnel Capabilities
Carry out systematic training on airflow pressure difference control knowledge for the workshop staff, enabling them to deeply understand the significance of pressure difference control and the handling methods of abnormal situations. When a pressure difference alarm occurs, the staff can quickly analyze the possible causes, such as equipment failures and pipeline leaks, and take effective countermeasures in a timely manner to ensure the continuity and stability of workshop production.
In - depth Data Analysis and Continuous Optimization of the Solutions
Build a professional airflow pressure difference data monitoring system and conduct in - depth analysis of the long - term accumulated pressure data. Through data analysis, potential problems can be keenly detected. For example, if the pressure in some areas fluctuates frequently, it may be due to equipment failures or unreasonable air distribution, and then targeted optimization adjustments can be made to continuously improve the airflow pressure difference control solutions.
With profound technical accumulation and rich project experience, Guangzhou Cleanroom Construction Co., Ltd. can not only provide high - quality purification equipment but also customize a full - range of airflow pressure difference control solutions and complete post - maintenance services for your semiconductor cleanroom. If you are planning to build a semiconductor cleanroom or encounter related problems during the operation of an existing workshop, please feel free to contact us. Let's work together to create an industry - leading semiconductor clean production environment and contribute to the development of the semiconductor industry.